Publication:

The impact of sequential-3D integration on semiconductor scaling roadmap

Date

2017
Proceedings Paper
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dc.contributor.authorMallik, Arindam
dc.contributor.authorVandooren, Anne
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorWalke, Amey
dc.contributor.authorFranco, Jacopo
dc.contributor.authorSherazi, Yasser
dc.contributor.authorWeckx, Pieter
dc.contributor.authorYakimets, Dmitry
dc.contributor.authorGarcia Bardon, Marie
dc.contributor.authorParvais, Bertrand
dc.contributor.authorDebacker, Peter
dc.contributor.authorKu, B.W.
dc.contributor.authorLim, S.K.
dc.contributor.authorMocuta, Anda
dc.contributor.authorMocuta, Dan
dc.contributor.authorRyckaert, Julien
dc.contributor.authorCollaert, Nadine
dc.contributor.authorRaghavan, Praveen
dc.contributor.imecauthorMallik, Arindam
dc.contributor.imecauthorVandooren, Anne
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorWalke, Amey
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorSherazi, Yasser
dc.contributor.imecauthorWeckx, Pieter
dc.contributor.imecauthorYakimets, Dmitry
dc.contributor.imecauthorGarcia Bardon, Marie
dc.contributor.imecauthorParvais, Bertrand
dc.contributor.imecauthorDebacker, Peter
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.orcidimecMallik, Arindam::0000-0002-0742-9366
dc.contributor.orcidimecVandooren, Anne::0000-0002-2412-0176
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecParvais, Bertrand::0000-0003-0769-7069
dc.contributor.orcidimecDebacker, Peter::0000-0003-3825-5554
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.accessioned2021-10-24T08:39:19Z
dc.date.available2021-10-24T08:39:19Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28905
dc.identifier.urlhttp://ieeexplore.ieee.org/document/8268483/
dc.source.beginpage717
dc.source.conferenceIEEE International Electron Device Meeting - IEDM
dc.source.conferencedate2/12/2017
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage720
dc.title

The impact of sequential-3D integration on semiconductor scaling roadmap

dc.typeProceedings paper
dspace.entity.typePublication
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