Publication:
Ultra thin chip stacking
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Labie, Riet | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Labie, Riet | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
| dc.date.accessioned | 2021-10-15T04:01:20Z | |
| dc.date.available | 2021-10-15T04:01:20Z | |
| dc.date.issued | 2003 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/7210 | |
| dc.source.conference | 3D System Integration Workshop | |
| dc.source.conferencedate | 16/12/2003 | |
| dc.source.conferencelocation | München Germany | |
| dc.title | Ultra thin chip stacking | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |