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Comparison of three methods to measure the internal pressure of empty MEMS packages

Date

2012
Proceedings Paper
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dc.contributor.authorWang, Bo
dc.contributor.authorTanaka, Shuji
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorSeveri, Simone
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorWevers, Martine
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorWang, Bo
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorSeveri, Simone
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-20T18:47:20Z
dc.date.available2021-10-20T18:47:20Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21828
dc.source.conference19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA
dc.source.conferencedate2/07/2012
dc.source.conferencelocationSingapore
dc.title

Comparison of three methods to measure the internal pressure of empty MEMS packages

dc.typeProceedings paper
dspace.entity.typePublication
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