Publication:
Extending on-die wiring hierarchy with wafer-level packaging concepts
Date
| dc.contributor.author | Balachandran, Jayaprakash | |
| dc.contributor.author | Brebels, Steven | |
| dc.contributor.author | Carchon, Geert | |
| dc.contributor.author | Webers, Tomas | |
| dc.contributor.author | De Raedt, Walter | |
| dc.contributor.author | Nauwelaers, Bart | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Brebels, Steven | |
| dc.contributor.imecauthor | Webers, Tomas | |
| dc.contributor.imecauthor | De Raedt, Walter | |
| dc.contributor.imecauthor | Nauwelaers, Bart | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Brebels, Steven::0000-0002-1568-0286 | |
| dc.contributor.orcidimec | De Raedt, Walter::0000-0002-7117-7976 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-15T12:40:38Z | |
| dc.date.available | 2021-10-15T12:40:38Z | |
| dc.date.issued | 2004 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8529 | |
| dc.source.beginpage | 105 | |
| dc.source.conference | IEEE International Interconnect Technology Conference | |
| dc.source.conferencedate | 7/06/2004 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.source.endpage | 107 | |
| dc.title | Extending on-die wiring hierarchy with wafer-level packaging concepts | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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