High-volume wafer-level production of hyperspectral sensors for handheld devices

dc.contributor.author	Dy, Eric
dc.contributor.author	Jayapala, Murali
dc.contributor.author	Lambrechts, Andy
dc.contributor.author	Baron, Jerome
dc.contributor.imecauthor	Jayapala, Murali
dc.contributor.imecauthor	Lambrechts, Andy
dc.contributor.imecauthor	Baron, Jerome
dc.contributor.orcidimec	Jayapala, Murali::0000-0001-7917-0149
dc.contributor.orcidimec	Lambrechts, Andy::0000-0001-7592-2999
dc.date.accessioned	2021-10-21T07:26:40Z
dc.date.available	2021-10-21T07:26:40Z
dc.date.issued	2013
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/22298
dc.source.conference	Trillion Sensors Summit
dc.source.conferencedate	23/10/2013
dc.source.conferencelocation	Stanford USA
dc.title	High-volume wafer-level production of hyperspectral sensors for handheld devices
dc.type	Oral presentation
dspace.entity.type	Publication
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