Publication:

Impact of emerging electrical and optical 3D integration technologies on high bandwidth interconnect systems

Date

2021
Dissertation
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-8803-8374
cris.virtualsource.departmentc4a4eb19-085c-45ab-b66e-8465e2ed7660
cris.virtualsource.orcidc4a4eb19-085c-45ab-b66e-8465e2ed7660
dc.contributor.advisorVerhelst, M.
dc.contributor.advisorHeyns, M.
dc.contributor.authorPantano, Nicolas
dc.date.accessioned2026-06-15T12:20:44Z
dc.date.available2026-06-15T12:20:44Z
dc.date.issued2021
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59695
dc.provenance.editstepusermeghan.oneill@imec.be
dc.title

Impact of emerging electrical and optical 3D integration technologies on high bandwidth interconnect systems

dc.typePHD thesis
dspace.entity.typePublication
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