Publication:

Industrial photonics packaging for high volume applications

Date

2024
Proceedings Paper
https://doi.org/10.1117/12.3000934
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dc.contributor.authorMilosevic, Milan M.
dc.contributor.authorTegegne, Zerihun G.
dc.contributor.authorZhong, Chunting
dc.contributor.authorvan Duinen, David
dc.contributor.authorYin, Xin
dc.contributor.authorBauwelinck, Johan
dc.contributor.authorMassaouti, Maria
dc.contributor.authorAndrianopoulos, Efstathios
dc.contributor.authorGroumas, Panos
dc.contributor.authorTheurer, Michael
dc.contributor.authorGupta, Durvasa Y.
dc.contributor.authorKresse, Martin
dc.contributor.authorWeigel, Madeleine
dc.contributor.authorDe Felipe, David
dc.contributor.authorKeil, Norbert
dc.contributor.authorvan Kerkhof, Joost
dc.contributor.imecauthorYin, Xin
dc.contributor.imecauthorBauwelinck, Johan
dc.contributor.orcidimecYin, Xin::0000-0002-9672-6652
dc.contributor.orcidimecBauwelinck, Johan::0000-0001-5254-2408
dc.date.accessioned2024-08-01T14:23:45Z
dc.date.available2024-06-15T17:25:55Z
dc.date.available2024-07-31T09:56:30Z
dc.date.available2024-08-01T14:23:45Z
dc.date.embargo2024-03-11
dc.date.issued2024
dc.description.wosFundingTextThis work was supported in part by the European Union's Horizon 2020 Research and Innovation Programme through the TERAWAY project (G.A. No 871668), the POETICS project (G.A. No 871769), and the PHOTO-SENS project (G.A. No 965643), which are all an initiative of the Photonics Public Private Partnership. This work was also supported in part by the photonixFAB project which is co-funded by the European Union under grant agreement no. 101111896. The photonixFAB project is supported by the Chips Joint Undertaking and its members, including top-up funding by Belgium, Germany, France, Israel, Italy, and the Netherlands, and it is also supported by Switzerland separately.
dc.identifier.doi10.1117/12.3000934
dc.identifier.eisbn978-1-5106-7045-7
dc.identifier.isbn978-1-5106-7044-0
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44057
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpage128920M
dc.source.conferenceConference on Optical Interconnects XXIV
dc.source.conferencedateJAN 29-31, 2024
dc.source.conferencelocationSan Francisco
dc.source.endpageN/A
dc.source.journalProceedings of SPIE
dc.source.numberofpages10
dc.source.volume12892
dc.title

Industrial photonics packaging for high volume applications

dc.typeProceedings paper
dspace.entity.typePublication
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