Publication:
New plating path for electroless copper deposition on sputtered barrier layers
Date
| dc.contributor.author | Lantasov, Yuri | |
| dc.contributor.author | Min, Woo Sig | |
| dc.contributor.author | Palmans, Roger | |
| dc.contributor.author | Maex, Karen | |
| dc.contributor.imecauthor | Maex, Karen | |
| dc.date.accessioned | 2021-10-06T11:41:09Z | |
| dc.date.available | 2021-10-06T11:41:09Z | |
| dc.date.issued | 1999 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/3609 | |
| dc.source.conference | European Workshop Materials for Advanced Metallization; March 8-10, 1999; Oostende, Belgium. | |
| dc.title | New plating path for electroless copper deposition on sputtered barrier layers | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |