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Dopant and carrier profiling for 3D-device architectures

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dc.contributor.authorMody, Jay
dc.contributor.authorKambham, Ajay Kumar
dc.contributor.authorZschaetzsch, Gerd
dc.contributor.authorChiarella, Thomas
dc.contributor.authorCollaert, Nadine
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorEyben, Pierre
dc.contributor.authorGilbert, Matthieu
dc.contributor.authorKoelling, Sebastian
dc.contributor.authorSchulze, Andreas
dc.contributor.authorHoffmann, Thomas Y.
dc.contributor.authorVandervorst, Wilfried
dc.contributor.imecauthorChiarella, Thomas
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorEyben, Pierre
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.orcidimecChiarella, Thomas::0000-0002-6155-9030
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.accessioned2021-10-19T16:27:06Z
dc.date.available2021-10-19T16:27:06Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19444
dc.source.conferenceInternational Workshop on Junction Technology
dc.source.conferencedate7/06/2011
dc.source.conferencelocationKyoto Japan
dc.title

Dopant and carrier profiling for 3D-device architectures

dc.typeProceedings paper
dspace.entity.typePublication
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