Publication:
Thermo-compression flip chip bonding using gold ball bumps for RF and MEMS application
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1886 since deposited on 2021-10-15
1last month
Acq. date: 2025-12-15
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Metrics
Views
1886 since deposited on 2021-10-15
1last month
Acq. date: 2025-12-15
Citations