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Conference contributions
Fine pitch micro-bump interconnections for advanced 3D chip stacking
Publication:
Fine pitch micro-bump interconnections for advanced 3D chip stacking
Date
2011
Proceedings Paper
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22173.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zhang, Wenqi
;
Limaye, Paresh
;
La Manna, Antonio
;
Soussan, Philippe
Journal
Abstract
Description
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1885
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations
Metrics
Views
1885
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations