Publication:
In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Date
| dc.contributor.author | Liebens, Maarten | |
| dc.contributor.imecauthor | Liebens, Maarten | |
| dc.date.accessioned | 2021-10-27T12:43:00Z | |
| dc.date.available | 2021-10-27T12:43:00Z | |
| dc.date.issued | 2019 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/33447 | |
| dc.source.book | SEMICON Korea Magazine | |
| dc.title | In-line metrology for characterization and control of extreme wafer thinning of bonded wafers | |
| dc.type | Book chapter | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |