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Ab initio screening of metallic MAX ceramics for advanced interconnect applications

 
dc.contributor.authorSankaran, Kiroubanand
dc.contributor.authorMoors, Kristof
dc.contributor.authorTokei, Zsolt
dc.contributor.authorAdelmann, Christoph
dc.contributor.authorPourtois, Geoffrey
dc.contributor.imecauthorSankaran, Kiroubanand
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.imecauthorPourtois, Geoffrey
dc.contributor.orcidextMoors, Kristof::0000-0002-8682-5286
dc.contributor.orcidimecSankaran, Kiroubanand::0000-0001-6988-7269
dc.contributor.orcidimecPourtois, Geoffrey::0000-0003-2597-8534
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.date.accessioned2022-03-08T14:46:56Z
dc.date.available2022-03-08T14:46:56Z
dc.date.issued2021
dc.identifier.doi10.1103/PhysRevMaterials.5.056002
dc.identifier.issn2475-9953
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39371
dc.publisherAMER PHYSICAL SOC
dc.source.beginpage056002
dc.source.issue5
dc.source.journalPHYSICAL REVIEW MATERIALS
dc.source.numberofpages9
dc.source.volume5
dc.subject.keywordsFUTURE COPPER INTERCONNECTS
dc.subject.keywordsM(N+1)AX(N) PHASES
dc.subject.keywordsRESISTIVITY
dc.subject.keywordsTECHNOLOGY
dc.title

Ab initio screening of metallic MAX ceramics for advanced interconnect applications

dc.typeJournal article
dspace.entity.typePublication
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