Publication:

Nondestructive monitoring of die warpage in encapsulated chip packages

Date

2016
Journal article
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dc.contributor.authorBose, Ankit
dc.contributor.authorVijayaraghavan, Rajani K
dc.contributor.authorCowley, Aidan
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorTanner, Brian K.
dc.contributor.authorDanilewsky, Andreas N.
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorMcNally, Patrick J.
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-23T10:09:29Z
dc.date.available2021-10-23T10:09:29Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26370
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7425195/
dc.source.beginpage653
dc.source.endpage662
dc.source.issue4
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.volume6
dc.title

Nondestructive monitoring of die warpage in encapsulated chip packages

dc.typeJournal article
dspace.entity.typePublication
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