Publication:

Electrical modeling and design of a wafer-level package for MEM resonators

Date

2010
Journal article
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dc.contributor.authorPerruisseau-Carrier, Julien
dc.contributor.authorMazza, Marco
dc.contributor.authorJourdain, Anne
dc.contributor.authorSkrivervik, Anja
dc.contributor.authorIonescu, Adrian
dc.contributor.authorTilmans, Harrie
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.date.accessioned2021-10-18T20:14:23Z
dc.date.available2021-10-18T20:14:23Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.issn1521-3323
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17795
dc.source.beginpage534
dc.source.endpage542
dc.source.issue2
dc.source.journalIEEE Transactions on Advanced Packaging
dc.source.volume33
dc.title

Electrical modeling and design of a wafer-level package for MEM resonators

dc.typeJournal article
dspace.entity.typePublication
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