Publication:
Thermal analysis of a 3D flip-chip fan-out wafer level package (fcFOWLP) for high bandwidth 3D integration
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1837 since deposited on 2021-10-27
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Acq. date: 2026-08-05
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1837 since deposited on 2021-10-27
2last month
1last week
Acq. date: 2026-08-05
Citations