Publication:

Fundamental study of IMC grains at low anneal temperature

Date

2022
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorGerets, Carine
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorShafahian, Ehsan
dc.contributor.authorCochet, Tom
dc.contributor.authorLa Tulipe, Douglas Charles
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorShafahian, Ehsan
dc.contributor.imecauthorCochet, Tom
dc.contributor.imecauthorLa Tulipe, Douglas Charles
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecShafahian, Ehsan::0000-0001-6125-5793
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2023-06-20T07:55:55Z
dc.date.available2022-09-22T02:50:27Z
dc.date.available2023-06-20T07:55:55Z
dc.date.issued2022
dc.identifier.eisbn978-4-9911911-3-8
dc.identifier.issnna
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40472
dc.publisherIEEE
dc.source.beginpage133
dc.source.conferenceInternational Conference on Electronics Packaging (ICEP)
dc.source.conferencedateMAY 11-14, 2022
dc.source.conferencelocationSapporo
dc.source.endpage134
dc.source.journalna
dc.source.numberofpages2
dc.title

Fundamental study of IMC grains at low anneal temperature

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions