Publication:
Additives in Cu plating for microelectronics applications
Date
| dc.contributor.author | Radisic, Alex | |
| dc.contributor.author | Ross, Frances | |
| dc.contributor.author | Haesevoets, Karel | |
| dc.contributor.author | Struyf, Herbert | |
| dc.contributor.author | Vereecken, Philippe | |
| dc.contributor.imecauthor | Radisic, Alex | |
| dc.contributor.imecauthor | Haesevoets, Karel | |
| dc.contributor.imecauthor | Struyf, Herbert | |
| dc.contributor.imecauthor | Vereecken, Philippe | |
| dc.contributor.orcidimec | Vereecken, Philippe::0000-0003-4115-0075 | |
| dc.date.accessioned | 2021-10-26T01:48:02Z | |
| dc.date.available | 2021-10-26T01:48:02Z | |
| dc.date.issued | 2018 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/31587 | |
| dc.identifier.url | http://ma.ecsdl.org/content/MA2018-01/19/1251 | |
| dc.source.beginpage | 1251 | |
| dc.source.conference | 233rd Electrochemical Society Meeting | |
| dc.source.conferencedate | 13/05/2018 | |
| dc.source.conferencelocation | Seattle, WA USA | |
| dc.title | Additives in Cu plating for microelectronics applications | |
| dc.type | Meeting abstract | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |