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Modeling of copper diffusion in amorphous aluminum oxide in CBRAM memory stack

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dc.contributor.authorSankaran, Kiroubanand
dc.contributor.authorGoux, Ludovic
dc.contributor.authorClima, Sergiu
dc.contributor.authorMees, Maarten
dc.contributor.authorKittl, Jorge
dc.contributor.authorJurczak, Gosia
dc.contributor.authorAltimime, Laith
dc.contributor.authorRignanese, Gian-Marco
dc.contributor.authorPourtois, Geoffrey
dc.contributor.imecauthorSankaran, Kiroubanand
dc.contributor.imecauthorGoux, Ludovic
dc.contributor.imecauthorClima, Sergiu
dc.contributor.imecauthorMees, Maarten
dc.contributor.imecauthorJurczak, Gosia
dc.contributor.imecauthorPourtois, Geoffrey
dc.contributor.orcidimecSankaran, Kiroubanand::0000-0001-6988-7269
dc.contributor.orcidimecGoux, Ludovic::0000-0002-1276-2278
dc.contributor.orcidimecClima, Sergiu::0000-0002-4044-9975
dc.contributor.orcidimecMees, Maarten::0000-0001-7217-5510
dc.contributor.orcidimecPourtois, Geoffrey::0000-0003-2597-8534
dc.date.accessioned2021-10-20T15:42:51Z
dc.date.available2021-10-20T15:42:51Z
dc.date.embargo9999-12-31
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21455
dc.source.beginpage317
dc.source.conferenceDielectrics for Nanosystems 5: Materials Science, Processing, Reliability, and Manufacturing -and- Tutorials in Nanotechnology
dc.source.conferencedate6/05/2012
dc.source.conferencelocationSeattle, WA USA
dc.source.endpage330
dc.title

Modeling of copper diffusion in amorphous aluminum oxide in CBRAM memory stack

dc.typeProceedings paper
dspace.entity.typePublication
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