Publication:

Effect of the intermetallics particles size on the brittle to ductile fracture transition in a bulk Sn-4wt%Ag-0.5wt% Cu solder

Date

2005-10
Proceedings Paper
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dc.contributor.authorRatchev, Petar
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVerlinden, Bert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.accessioned2021-10-16T04:26:04Z
dc.date.available2021-10-16T04:26:04Z
dc.date.issued2005-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11087
dc.source.conferenceIPC/JEDEC 10th International Conference on Lead Free Electronic Components and Assemblies
dc.source.conferencedate18/10/2005
dc.source.conferencelocationBrussels Belgium
dc.title

Effect of the intermetallics particles size on the brittle to ductile fracture transition in a bulk Sn-4wt%Ag-0.5wt% Cu solder

dc.typeProceedings paper
dspace.entity.typePublication
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