Publication:
The vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructures
Date
| dc.contributor.author | Dessein, Kristof | |
| dc.contributor.author | Kumar, P. S. A. | |
| dc.contributor.author | Nemeth, Stefan | |
| dc.contributor.author | Delaey, L. | |
| dc.contributor.author | Borghs, Gustaaf | |
| dc.contributor.author | De Boeck, Jo | |
| dc.contributor.imecauthor | Nemeth, Stefan | |
| dc.contributor.imecauthor | Borghs, Gustaaf | |
| dc.contributor.imecauthor | De Boeck, Jo | |
| dc.date.accessioned | 2021-10-14T16:50:36Z | |
| dc.date.available | 2021-10-14T16:50:36Z | |
| dc.date.issued | 2001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5244 | |
| dc.source.beginpage | 906 | |
| dc.source.endpage | 910 | |
| dc.source.journal | Journal of Crystal Growth | |
| dc.source.volume | 227 | |
| dc.title | The vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructures | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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