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A die-to-wafer bonding approach to photonics integration

Date

2007
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dc.contributor.authorRoelkens, Gunther
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorBaets, Roel
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorBaets, Roel
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecBaets, Roel::0000-0003-1266-1319
dc.date.accessioned2021-10-16T19:04:53Z
dc.date.available2021-10-16T19:04:53Z
dc.date.embargo9999-12-31
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12787
dc.source.conferenceePIXnet Winter School '07, Applications of Photonic Integration
dc.source.conferencedate11/03/2007
dc.source.conferencelocationPontresina Switzerland
dc.title

A die-to-wafer bonding approach to photonics integration

dc.typeOral presentation
dspace.entity.typePublication
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