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Reliability of copper dual damascene influenced by pre-clean

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dc.contributor.authorTokei, Zsolt
dc.contributor.authorLanckmans, Filip
dc.contributor.authorVan den Bosch, Geert
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorMaex, Karen
dc.contributor.authorBender, Hugo
dc.contributor.authorHens, S.
dc.contributor.authorVan Landuyt, J.
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVan den Bosch, Geert
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorBender, Hugo
dc.contributor.orcidimecVan den Bosch, Geert::0000-0001-9971-6954
dc.date.accessioned2021-10-14T23:22:49Z
dc.date.available2021-10-14T23:22:49Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6885
dc.source.beginpage118
dc.source.conferenceProceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA
dc.source.conferencedate8/07/2002
dc.source.conferencelocationSingapore
dc.source.endpage123
dc.title

Reliability of copper dual damascene influenced by pre-clean

dc.typeProceedings paper
dspace.entity.typePublication
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