Copper CMP with composite polymer core – silica shell abrasives: a defectivity study

dc.contributor.author	Armini, Silvia
dc.contributor.author	Whelan, Caroline
dc.contributor.author	Moinpour, Mansour
dc.contributor.author	Maex, Karen
dc.contributor.imecauthor	Armini, Silvia
dc.contributor.imecauthor	Maex, Karen
dc.contributor.orcidimec	Armini, Silvia::0000-0003-0578-3422
dc.date.accessioned	2021-10-17T06:14:10Z
dc.date.available	2021-10-17T06:14:10Z
dc.date.issued	2008
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/13317
dc.identifier.url	http://www.mrs.org/s_mrs/sec_subscribe.asp?CID=12434&DID=205509
dc.source.beginpage	1079-N11-04
dc.source.conference	Materials and Processes for Advanced Interconnects for Microelectronics
dc.source.conferencedate	24/03/2008
dc.source.conferencelocation	San Francisco, CA USA
dc.title	Copper CMP with composite polymer core – silica shell abrasives: a defectivity study
dc.type	Proceedings paper
dspace.entity.type	Publication
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