Publication:

Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications

Date

2016
Meeting abstract
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dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorHonore, Mia
dc.contributor.authorRadisic, Alex
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorArnold, Marco
dc.contributor.authorFluegel, Alexander
dc.contributor.authorShu-Ya Chang, Iris
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMayer, Dieter
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecEl-Mekki, Zaid::0000-0002-9851-9139
dc.contributor.orcidimecStruyf, Herbert::0000-0002-6782-5424
dc.date.accessioned2021-10-23T10:44:43Z
dc.date.available2021-10-23T10:44:43Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26597
dc.source.conference13th Annual International Wafer-Level Packaging Conference - IWLPC
dc.source.conferencedate18/10/2016
dc.source.conferencelocationSan Jose, CA USA
dc.title

Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications

dc.typeMeeting abstract
dspace.entity.typePublication
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