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Stress analysis on ultra thin ground wafers

Date

2008
Journal article
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dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorDe Munck, Koen
dc.contributor.authorDe Moor, Piet
dc.contributor.authorBaert, Kris
dc.contributor.authorSwinnen, Bart
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorKnüttel, Alexander
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorVan Hoof, Chris
dc.date.accessioned2021-10-17T06:38:16Z
dc.date.available2021-10-17T06:38:16Z
dc.date.issued2008
dc.identifier.issn1807-1953
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13563
dc.identifier.urlhttp://www.sbmicro.org.br/jics/
dc.source.beginpage83
dc.source.endpage89
dc.source.issue2
dc.source.journalJournal of Integrated Circuits and Systems
dc.source.volume3
dc.title

Stress analysis on ultra thin ground wafers

dc.typeJournal article
dspace.entity.typePublication
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