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New cleaning solutions for all-wet-post etch residue removal on Cu BEOL for sub 45nm nodes
Publication:
New cleaning solutions for all-wet-post etch residue removal on Cu BEOL for sub 45nm nodes
Date
2009
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Klipp, Andreas
;
Vereecke, Guy
;
Le, Quoc Toan
;
Claes, Martine
Journal
Abstract
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1867
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations
Metrics
Views
1867
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations