Publication:
3D interconnect and packaging technology
Date
| dc.contributor.author | Mercha, Abdelkarim | |
| dc.contributor.imecauthor | Mercha, Abdelkarim | |
| dc.contributor.orcidimec | Mercha, Abdelkarim::0000-0002-2174-6958 | |
| dc.date.accessioned | 2021-10-19T16:14:35Z | |
| dc.date.available | 2021-10-19T16:14:35Z | |
| dc.date.issued | 2011 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/19414 | |
| dc.source.conference | SOI Conference | |
| dc.source.conferencedate | 3/10/2011 | |
| dc.source.conferencelocation | Tempe, AZ USA | |
| dc.title | 3D interconnect and packaging technology | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |