Publication:
Impact of various test flows on the cost in 3D D2W stacking
Date
| dc.contributor.author | Taouil, Mottaqiallah | |
| dc.contributor.author | Hamdioui, Said | |
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-18T22:13:23Z | |
| dc.date.available | 2021-10-18T22:13:23Z | |
| dc.date.issued | 2010-11 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18070 | |
| dc.source.beginpage | 1 | |
| dc.source.conference | IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits - 3D-TEST | |
| dc.source.conferencedate | 4/11/2010 | |
| dc.source.conferencelocation | Austin, TX USA | |
| dc.title | Impact of various test flows on the cost in 3D D2W stacking | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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