Publication:

Minimizing interposer warpage by process control and design optimization

Date

 
dc.contributor.authorDetalle, Mikael
dc.contributor.authorVandevelde, Bart
dc.contributor.authorNolmans, Philip
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorGonzalez, Mario
dc.contributor.authorMiller, Andy
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T01:15:41Z
dc.date.available2021-10-22T01:15:41Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23757
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6897263&contentType=Conference+Publications
dc.source.beginpage33
dc.source.conferenceIEEE 64th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2014
dc.source.conferencelocationLake Buena Vista, FL USA
dc.source.endpage40
dc.title

Minimizing interposer warpage by process control and design optimization

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
28032.pdf
Size:
3.35 MB
Format:
Adobe Portable Document Format
Publication available in collections: