Publication:

Substrate bonding techniques for CMOS processed wafers

Date

1996
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorvan der Groen, Sonja
dc.contributor.authorRosmeulen, Maarten
dc.contributor.authorBaert, Kris
dc.contributor.authorJansen, Philippe
dc.contributor.authorDeferm, Ludo
dc.contributor.imecauthorRosmeulen, Maarten
dc.contributor.imecauthorDeferm, Ludo
dc.contributor.orcidimecRosmeulen, Maarten::0000-0002-3663-7439
dc.date.accessioned2021-09-29T15:37:25Z
dc.date.available2021-09-29T15:37:25Z
dc.date.embargo9999-12-31
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1566
dc.source.beginpage12
dc.source.conference7th Micromechanics Europe Workshop - MME
dc.source.conferencedate21/10/1996
dc.source.conferencelocationBarcelona Spain
dc.source.endpage15
dc.title

Substrate bonding techniques for CMOS processed wafers

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
1537.pdf
Size:
198.57 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions