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The Polymer Stud Grid Array (PSGA) package: test and electrical characterization for RF applications

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dc.contributor.authorChandrasekhar, Arun
dc.contributor.authorPieters, Philip
dc.contributor.authorVaesen, Kristof
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorVan Puymbroeck, Jan
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.imecauthorVan Puymbroeck, Jan
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.accessioned2021-10-14T16:41:11Z
dc.date.available2021-10-14T16:41:11Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5133
dc.source.beginpage496
dc.source.conferenceProceedings International Conference on Electronics Packaging; 18-20 April 2001; Tokyo, Japan.
dc.source.conferencelocation
dc.source.endpage501
dc.title

The Polymer Stud Grid Array (PSGA) package: test and electrical characterization for RF applications

dc.typeProceedings paper
dspace.entity.typePublication
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