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Fast and distributed thermal model for thermal modeling of GaN power devices
Publication:
Fast and distributed thermal model for thermal modeling of GaN power devices
Date
2018-10
Journal article
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sodan, Vice
;
Stoffels, Steve
;
Oprins, Herman
;
Decoutere, Stefaan
;
Altmann, Frank
;
Baelmans, Martine
;
De Wolf, Ingrid
Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology
Abstract
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Views
1966
since deposited on 2021-10-26
Acq. date: 2025-10-27
Citations
Metrics
Views
1966
since deposited on 2021-10-26
Acq. date: 2025-10-27
Citations