Publication:

Trends beim Einbau von MEMS auf Wafer-Ebene

Date

2003-11
Journal article
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dc.contributor.authorBaert, Kris
dc.contributor.authorDe Moor, Piet
dc.contributor.authorTilmans, Harrie
dc.contributor.authorJohn, Joachim
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Bavel, Mieke
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorJohn, Joachim
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Bavel, Mieke
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecJohn, Joachim::0000-0003-0155-2854
dc.contributor.orcidimecVan Hoof, Chris::0000-0002-4645-3326
dc.date.accessioned2021-10-15T03:59:39Z
dc.date.available2021-10-15T03:59:39Z
dc.date.issued2003-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7169
dc.source.beginpage76
dc.source.endpage79
dc.source.journalElektronik Produktion und Prüftechnik
dc.title

Trends beim Einbau von MEMS auf Wafer-Ebene

dc.typeJournal article
dspace.entity.typePublication
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