Low-Temperature Chemical Vapor Deposition of SiCN for Hybrid Bonding

dc.contributor.author	Onishi, Koki
dc.contributor.author	Iwata, Tomoya
dc.contributor.author	Habuka, Hitoshi
dc.contributor.author	Nagano, Fuya
dc.contributor.author	Inoue, Fumihiro
dc.contributor.imecauthor	Nagano, Fuya
dc.contributor.orcidimec	Nagano, Fuya::0000-0001-5315-8694
dc.date.accessioned	2022-12-19T10:03:31Z
dc.date.available	2022-09-22T02:50:45Z
dc.date.available	2022-12-19T10:03:31Z
dc.date.issued	2022
dc.identifier.doi	10.23919/ICEP55381.2022.9795550
dc.identifier.eisbn	978-4-9911911-3-8
dc.identifier.issn	na
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/40482
dc.publisher	IEEE
dc.source.beginpage	59
dc.source.conference	International Conference on Electronics Packaging (ICEP)
dc.source.conferencedate	MAY 11-14, 2022
dc.source.conferencelocation	Sapporo
dc.source.endpage	60
dc.source.journal	NEURO-ONCOLOGY. Vol. 24; Suppl. 2
dc.source.numberofpages	2
dc.title	Low-Temperature Chemical Vapor Deposition of SiCN for Hybrid Bonding
dc.type	Proceedings paper
dspace.entity.type	Publication
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