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Self-assembled monolayers as Cu diffusion barriers for advanced interconections: molecular engineering

Date

2008
Meeting abstract
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dc.contributor.authorMaestre Caro, Arantxa
dc.contributor.authorMaes, Guido
dc.contributor.authorBorghs, Gustaaf
dc.contributor.authorWhelan, Caroline
dc.contributor.imecauthorBorghs, Gustaaf
dc.date.accessioned2021-10-17T08:40:42Z
dc.date.available2021-10-17T08:40:42Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14095
dc.source.beginpage89
dc.source.conference17th Workshop Materials for Advanced Metallization
dc.source.conferencedate2/03/2008
dc.source.conferencelocationDresden Germany
dc.source.endpage90
dc.title

Self-assembled monolayers as Cu diffusion barriers for advanced interconections: molecular engineering

dc.typeMeeting abstract
dspace.entity.typePublication
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