Publication:

SEM based overlay measurement between via patterns and buried M1 patterns using high voltage SEM

Date

2017
Proceedings Paper
https://doi.org/10.1117/12.2257848
Simple item page Full metadata Statistics
 
dc.contributor.authorHasumi, Kazuhisa
dc.contributor.authorInoue, Osamu
dc.contributor.authorOkagawa, Yutaka
dc.contributor.authorShao, Chuanyu
dc.contributor.authorLeray, Philippe
dc.contributor.authorHalder, Sandip
dc.contributor.authorLorusso, Gian
dc.contributor.authorJehoul, Christiane
dc.contributor.imecauthorLeray, Philippe
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorLorusso, Gian
dc.contributor.imecauthorJehoul, Christiane
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.date.accessioned2021-10-24T05:29:03Z
dc.date.available2021-10-24T05:29:03Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.doi10.1117/12.2257848
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28465
dc.source.beginpage101451J
dc.source.conferenceMetrology, Inspection, and Process Control for Microlithography XXXI
dc.source.conferencedate26/02/2017
dc.source.conferencelocationSan Jose, CA USA
dc.title

SEM based overlay measurement between via patterns and buried M1 patterns using high voltage SEM

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
37297.pdf
Size:
1019.51 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions