Publication:

Silicon-quartz microcapillary opto-fluidic platform obtained by CMOS-compatible Die to Wafer 200 mm dual bonding process

Date

2018
Proceedings Paper
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dc.contributor.authorFiorentino, Giuseppe
dc.contributor.authorJones, Ben
dc.contributor.authorRoth, Sophie
dc.contributor.authorGrac, Edith
dc.contributor.authorJayapala, Murali
dc.contributor.authorBex, Pieter
dc.contributor.authorDuarte de Almeida, Daniel
dc.contributor.authorHumbert, Aurelie
dc.contributor.authorSeveri, Simone
dc.contributor.imecauthorFiorentino, Giuseppe
dc.contributor.imecauthorJones, Ben
dc.contributor.imecauthorRoth, Sophie
dc.contributor.imecauthorJayapala, Murali
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorHumbert, Aurelie
dc.contributor.imecauthorSeveri, Simone
dc.contributor.orcidimecJayapala, Murali::0000-0001-7917-0149
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecHumbert, Aurelie::0000-0002-2538-8991
dc.date.accessioned2021-10-25T18:38:58Z
dc.date.available2021-10-25T18:38:58Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30707
dc.identifier.urlhttps://doi.org/10.3390/proceedings2131018
dc.source.beginpage1018
dc.source.conferenceEurosensors 2018
dc.source.conferencedate9/09/2018
dc.source.conferencelocationGraz Austria
dc.title

Silicon-quartz microcapillary opto-fluidic platform obtained by CMOS-compatible Die to Wafer 200 mm dual bonding process

dc.typeProceedings paper
dspace.entity.typePublication
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