Publication:
Quality versus cost analysis for 3D stacked ICs
Date
| dc.contributor.author | Taouil, Mottaqiallah | |
| dc.contributor.author | Hamdioui, Said | |
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-22T06:27:18Z | |
| dc.date.available | 2021-10-22T06:27:18Z | |
| dc.date.issued | 2014-04 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/24601 | |
| dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6818763 | |
| dc.source.beginpage | 1 | |
| dc.source.conference | IEEE VLSI Test Symposium - VTS | |
| dc.source.conferencedate | 13/04/2014 | |
| dc.source.conferencelocation | Napa, CA USA | |
| dc.source.endpage | 6 | |
| dc.title | Quality versus cost analysis for 3D stacked ICs | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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