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Integration of the ZoneBOND™ temporary bonding material in backside processing for 3D applications
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Integration of the ZoneBOND™ temporary bonding material in backside processing for 3D applications
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Date
2012-09
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Jourdain, Anne
;
Phommahaxay, Alain
;
Verbinnen, Greet
;
Suhard, Samuel
;
Miller, Andy
;
Swinnen, Bart
;
Beyer, Gerald
;
Beyne, Eric
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1931
since deposited on 2021-10-20
Acq. date: 2025-12-15
Citations
Metrics
Views
1931
since deposited on 2021-10-20
Acq. date: 2025-12-15
Citations