Publication:
Two-step room temperature grain growth in electroplated copper
Date
| dc.contributor.author | Brongersma, Sywert | |
| dc.contributor.author | Richard, Emmanuel | |
| dc.contributor.author | Vervoort, Iwan | |
| dc.contributor.author | Bender, Hugo | |
| dc.contributor.author | Vandervorst, Wilfried | |
| dc.contributor.author | Lagrange, Sébastien | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Maex, Karen | |
| dc.contributor.imecauthor | Brongersma, Sywert | |
| dc.contributor.imecauthor | Bender, Hugo | |
| dc.contributor.imecauthor | Vandervorst, Wilfried | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Maex, Karen | |
| dc.contributor.orcidimec | Brongersma, Sywert::0000-0002-1755-3897 | |
| dc.date.accessioned | 2021-10-06T10:46:13Z | |
| dc.date.available | 2021-10-06T10:46:13Z | |
| dc.date.issued | 1999 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/3278 | |
| dc.source.beginpage | 3642 | |
| dc.source.endpage | 3645 | |
| dc.source.issue | 7 | |
| dc.source.journal | J. Appl. Phys. | |
| dc.source.volume | 86 | |
| dc.title | Two-step room temperature grain growth in electroplated copper | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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