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One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material

Date

2018
Proceedings Paper
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dc.contributor.authorFlack, Warren
dc.contributor.authorHsieh, Robert
dc.contributor.authorNguyen, Ha-Ai
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorSuhard, Samuel
dc.contributor.authorMiller, Andy
dc.contributor.authorHiro, Akito
dc.contributor.authorHidremont, Romain
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorHiro, Akito
dc.date.accessioned2021-10-25T18:39:40Z
dc.date.available2021-10-25T18:39:40Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30709
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8654363
dc.source.beginpage395
dc.source.conference2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
dc.source.conferencedate4/12/2018
dc.source.conferencelocationSingapore Singapore
dc.source.endpage400
dc.title

One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material

dc.typeProceedings paper
dspace.entity.typePublication
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