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Optimization methods for post-bond testing of 3D stacked ICs
Publication:
Optimization methods for post-bond testing of 3D stacked ICs
Date
2012-02
Journal article
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Noia, Brandon
;
Chakrabarty, Krishnendu
;
Marinissen, Erik Jan
Journal
Journal of Electronic Testing - Theory and Applications
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1908
since deposited on 2021-10-20
Acq. date: 2025-10-23
Citations
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Views
1908
since deposited on 2021-10-20
Acq. date: 2025-10-23
Citations