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Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process
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Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process
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Date
1998
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2725.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Gao, Teng
;
Coenegrachts, Bart
;
Waeterloos, Joost
;
Beyer, Gerald
;
Meynen, Herman
;
Van Hove, Marleen
;
Maex, Karen
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1975
since deposited on 2021-09-30
1
last month
Acq. date: 2025-12-10
Citations
Metrics
Views
1975
since deposited on 2021-09-30
1
last month
Acq. date: 2025-12-10
Citations