Publication:

3D integration technology developments at IMEC

Date

2007-11
Proceedings Paper
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dc.contributor.authorDe Moor, Piet
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBaert, Kris
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-16T15:32:20Z
dc.date.available2021-10-16T15:32:20Z
dc.date.embargo9999-12-31
dc.date.issued2007-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11963
dc.source.beginpage301
dc.source.conference1st Int. IEEE Workshop on Low Temperature Bonding for 3D Integration
dc.source.conferencedate8/11/2007
dc.source.conferencelocationTokyo Japan
dc.source.endpage334
dc.title

3D integration technology developments at IMEC

dc.typeProceedings paper
dspace.entity.typePublication
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