Publication:
Electrodeposition for 3D integration. Investigating copper electrodeposition for 'through-silicon via' applications
Date
| dc.contributor.author | Luhn, Ole | |
| dc.contributor.thesisadvisor | Celis, Jean-Pierre | |
| dc.contributor.thesisadvisor | Van Hoof, Chris | |
| dc.date.accessioned | 2021-10-18T00:17:04Z | |
| dc.date.available | 2021-10-18T00:17:04Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2009-12 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/15764 | |
| dc.title | Electrodeposition for 3D integration. Investigating copper electrodeposition for 'through-silicon via' applications | |
| dc.type | PHD thesis | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |