Publication:
Characterization of oxidation of the electroplated Sn for advanced flip-chip bonding
Date
| dc.contributor.author | Zhang, Wenqi | |
| dc.contributor.author | Ruythooren, Wouter | |
| dc.contributor.imecauthor | Ruythooren, Wouter | |
| dc.date.accessioned | 2021-10-18T05:42:31Z | |
| dc.date.available | 2021-10-18T05:42:31Z | |
| dc.date.issued | 2009 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16599 | |
| dc.source.conference | 17th European Microelectronics and Packaging Conference & Exhibition - EMPC | |
| dc.source.conferencedate | 15/06/2009 | |
| dc.source.conferencelocation | Rimini Italy | |
| dc.title | Characterization of oxidation of the electroplated Sn for advanced flip-chip bonding | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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