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Impact of bonding interface thickness on the performance of silicon-integrated hybrid-cavity VCSELs

Date

2016
Proceedings Paper
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dc.contributor.authorHaglund, E.P.
dc.contributor.authorKumari, Sulakshna
dc.contributor.authorHaglund, E.
dc.contributor.authorGustavsson, Johan S.
dc.contributor.authorBaets, Roel
dc.contributor.authorRoelkens, Gunther
dc.contributor.authorLarsson, A.
dc.contributor.imecauthorKumari, Sulakshna
dc.contributor.imecauthorBaets, Roel
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.orcidimecBaets, Roel::0000-0003-1266-1319
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.date.accessioned2021-10-23T11:05:21Z
dc.date.available2021-10-23T11:05:21Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26682
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7765752
dc.source.beginpageTuD8
dc.source.conferenceThe 25th International conference Semiconductor Laser Conference - ISLC
dc.source.conferencedate12/09/2016
dc.source.conferencelocationKobe Japan
dc.title

Impact of bonding interface thickness on the performance of silicon-integrated hybrid-cavity VCSELs

dc.typeProceedings paper
dspace.entity.typePublication
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