Publication:

On correlation between hot-carrier stress induced device parameter degradation and time-zero variability

Date

2019
Proceedings Paper
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dc.contributor.authorMakarov, Alexander
dc.contributor.authorRoussel, Philippe
dc.contributor.authorBury, Erik
dc.contributor.authorVandemaele, Michiel
dc.contributor.authorSpessot, Alessio
dc.contributor.authorLinten, Dimitri
dc.contributor.authorKaczer, Ben
dc.contributor.authorTyaginov, Stanislav
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorBury, Erik
dc.contributor.imecauthorVandemaele, Michiel
dc.contributor.imecauthorSpessot, Alessio
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorKaczer, Ben
dc.contributor.imecauthorTyaginov, Stanislav
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecBury, Erik::0000-0002-5847-3949
dc.contributor.orcidimecVandemaele, Michiel::0000-0003-0740-4115
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.date.accessioned2021-10-27T13:18:57Z
dc.date.available2021-10-27T13:18:57Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33514
dc.identifier.urlhttps://ieeexplore.ieee.org/abstract/document/8989882
dc.source.beginpage1
dc.source.conferenceInternational Integrated Reliability Workshop 2019 - IIRW
dc.source.conferencedate13/10/2019
dc.source.conferencelocationSouth Lake Tahoe, CA USA
dc.source.endpage4
dc.title

On correlation between hot-carrier stress induced device parameter degradation and time-zero variability

dc.typeProceedings paper
dspace.entity.typePublication
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