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From C4 PbSn flip chip to Lead-free μbump flip chip

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dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-19T12:34:54Z
dc.date.available2021-10-19T12:34:54Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18570
dc.source.conferenceSeminar "Vijf jaar Loodvrij Solderen"
dc.source.conferencedate22/09/2011
dc.source.conferencelocationEindhoven The Netherlands
dc.title

From C4 PbSn flip chip to Lead-free μbump flip chip

dc.typeOral presentation
dspace.entity.typePublication
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